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Microstructure and shear behavior of solder joint with Sn58Bi/Sn3.0Ag0.5Cu/Cu superposition structure
by:
Liu, Yang
Published in:
Journal of materials science / Materials in electronics
(2019)
lizenzpflichtig
electronic Article
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Evolution of the Microstructure of Sn58Bi Solder Paste with Sn-3.0Ag-0.5Cu Addition During Isothermal Aging
by:
Xu, Ruisheng
Published in:
Journal of electronic materials
(2018)
lizenzpflichtig
electronic Article
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electronic Article
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Liu, Yang
Sun, Fenglian
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Xu, Ruisheng
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Zhang, Hao
Li, Zhao
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Zhang, Guoqi
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