Microstructure and shear behavior of solder joint with Sn58Bi/Sn3.0Ag0.5Cu/Cu superposition structure

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Bibliographic Details

Published in:	Journal of materials science / Materials in electronics. - Springer US, 1990. - 30(2019), 15 vom: 01. Juli, Seite 14077-14084
Main Author:	Liu, Yang (Author)
Other Authors:	Xu, Ruisheng (Author) Zhang, Hao (Author) Sun, Fenglian (Author)
Format:	electronic Article
Language:	English
Published:	2019
ISSN:	1573-482X
External Sources:	lizenzpflichtig