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Xu, Ruisheng
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Xu, Ruisheng
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Xu, Ruisheng
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1
Evolution of the Microstructure of Sn58Bi Solder Paste with Sn-3.0Ag-0.5Cu Addition During Isothermal Aging
by:
Xu
,
Ruisheng
Published in:
Journal of electronic materials
(2018)
lizenzpflichtig
electronic Article
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2
Microstructure and shear behavior of solder joint with Sn58Bi/Sn3.0Ag0.5Cu/Cu superposition structure
by:
Liu, Yang
Published in:
Journal of materials science / Materials in electronics
(2019)
Other Authors:
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...
Xu
,
Ruisheng
...
”
lizenzpflichtig
electronic Article
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Related Subjects
IMC
SAC
SnBi
isothermal aging
microstructure
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