Effects of Cu and In on the microstructure evolution and mechanical properties of Sn-20Bi/Cu solder joints

Full description

Bibliographic Details

Published in:	Journal of materials science / Materials in electronics. - Springer US, 1990. - 34(2023), 6 vom: Feb.
Main Author:	Qi, Da (Author)
Other Authors:	Yang, Wen chao (Author) Zhao, Hong (Author) Zhang, Lei (Author) Jiang, Shi wei (Author) Song, Qian qian (Author) Fu, Yao kun (Author) Zhan, Yong zhong (Author)
Format:	electronic Article
Language:	English
Published:	2023
ISSN:	1573-482X
External Sources:	lizenzpflichtig