APA (7th ed.) Citation

Qi, D., Yang, W. c., Zhao, H., Zhang, L., Jiang, S. w., Song, Q. q., . . . Zhan, Y. z. (2023). Effects of Cu and In on the microstructure evolution and mechanical properties of Sn-20Bi/Cu solder joints. Journal of materials science / Materials in electronics, 34(6), . https://doi.org/10.1007/s10854-022-09593-9

Chicago Style (17th ed.) Citation

Qi, Da, Wen chao Yang, Hong Zhao, Lei Zhang, Shi wei Jiang, Qian qian Song, Yao kun Fu, and Yong zhong Zhan. "Effects of Cu and In on the Microstructure Evolution and Mechanical Properties of Sn-20Bi/Cu Solder Joints." Journal of Materials Science / Materials in Electronics 34, no. 6 (2023). https://dx.doi.org/10.1007/s10854-022-09593-9.

MLA (8th ed.) Citation

Qi, Da, et al. "Effects of Cu and In on the Microstructure Evolution and Mechanical Properties of Sn-20Bi/Cu Solder Joints." Journal of Materials Science / Materials in Electronics, vol. 34, no. 6, 2023.