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Author:
Liu, Yang
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Meerwijk, Joost
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Sun, Fenglian
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Author:
Liu, Yang
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Meerwijk, Joost
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Sun, Fenglian
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Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging
by:
Liu, Yang
Published in:
Journal of materials science / Materials in electronics
(2014)
lizenzpflichtig
electronic Article
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electronic Article
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Liu, Yang
Luo, Liangliang
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Meerwijk, Joost
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Sun, Fenglian
Yuan, Cadmus A.
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Zhang, Guoqi
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