Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging

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Bibliographic Details

Published in:	Journal of materials science / Materials in electronics. - Springer US, 1990. - 25(2014), 11 vom: 22. Aug., Seite 4954-4959
Main Author:	Liu, Yang (Author)
Other Authors:	Meerwijk, Joost (Author) Luo, Liangliang (Author) Zhang, Honglin (Author) Sun, Fenglian (Author) Yuan, Cadmus A. (Author) Zhang, Guoqi (Author)
Format:	electronic Article
Language:	English
Published:	2014
ISSN:	1573-482X
External Sources:	lizenzpflichtig