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Bulk Solder
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Charpy impact test
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High Resolution Transmission Electron Microscopy
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Illumination Time
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Significant Morphological Change
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Sn-3.5Ag solder
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1
Fusion behaviour and mechanism of ultrafine Ag-Cu nanoparticles induced by electron beam irradiation
by:
Liu, Xiaojian
Published in:
Journal of materials science / Materials in electronics
(2017)
lizenzpflichtig
electronic Article
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2
Effect of intermetallic compounds on fracture behaviors of Sn3.0Ag0.5Cu lead-free solder joints during in situ tensile test
by:
Tian, Yanhong
Published in:
Journal of materials science / Materials in electronics
(2011)
lizenzpflichtig
electronic Article
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3
Effect of Aging Time on Ductile–Brittle Transition Behaviors of Sn-3.5Ag Solder
by:
Zhao, Xiangxi
Published in:
Journal of electronic materials
(2022)
lizenzpflichtig
electronic Article
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electronic Article
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An, Rong
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Liu, Wei
Wang, Chunqing
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Zhang, Wei
Hang, Chunjin
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Liu, Xiaojian
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Niu, Lina
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Tian, Yanhong
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Zhao, Xiangxi
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Zheng, Zhen
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