Effect of intermetallic compounds on fracture behaviors of Sn3.0Ag0.5Cu lead-free solder joints during in situ tensile test

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Bibliographic Details

Published in:	Journal of materials science / Materials in electronics. - Springer US, 1990. - 23(2011), 1 vom: 16. Okt., Seite 136-147
Main Author:	Tian, Yanhong (Author)
Other Authors:	Liu, Wei (Author) An, Rong (Author) Zhang, Wei (Author) Niu, Lina (Author) Wang, Chunqing (Author)
Format:	electronic Article
Language:	English
Published:	2011
ISSN:	1573-482X
External Sources:	lizenzpflichtig