Solvent modulation, microstructure evaluation, process optimization, and nanoindentation analysis of micro-CuAg core–shell sintering paste for power electronics packaging

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Bibliographic Details

Published in:	Journal of materials science / Materials in electronics. - Springer US, 1990. - 34(2023), 24 vom: Aug.
Main Author:	Chen, Haixue (Author)
Other Authors:	Wang, Xinyue (Author) Zeng, Zejun (Author) Zhang, Guoqi (Author) Zhang, Jing (Author) Liu, Pan (Author)
Format:	electronic Article
Language:	English
Published:	2023
ISSN:	1573-482X
External Sources:	lizenzpflichtig