Microstructure and hardness of SAC305-xNi solder on Cu and graphene-coated Cu substrates

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Bibliographic Details

Published in:	Journal of materials science / Materials in electronics. - Springer US, 1990. - 29(2018), 15 vom: 09. Juni, Seite 13167-13175
Main Author:	Liu, Yang (Author)
Other Authors:	Li, Shengli (Author) Zhang, Hao (Author) Cai, Hongming (Author) Sun, Fenglian (Author) Zhang, Guoqi (Author)
Format:	electronic Article
Language:	English
Published:	2018
ISSN:	1573-482X
External Sources:	lizenzpflichtig