Effect of Ni, Bi concentration on the microstructure and shear behavior of low-Ag SAC–Bi–Ni/Cu solder joints

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Bibliographic Details

Published in:	Journal of materials science / Materials in electronics. - Springer US, 1990. - 25(2014), 6 vom: 06. Apr., Seite 2627-2633
Main Author:	Liu, Yang (Author)
Other Authors:	Sun, Fenglian (Author) Li, Xuemei (Author)
Format:	electronic Article
Language:	English
Published:	2014
ISSN:	1573-482X
External Sources:	lizenzpflichtig