High-adhesive electroless copper plating on polyethylene surface modified with primer

Full description

Bibliographic Details

Published in:	Journal of solid state electrochemistry. - Springer Berlin Heidelberg, 1997. - 21(2017), 6 vom: 01. Feb., Seite 1559-1566
Main Author:	Huang, Junjun (Author)
Other Authors:	Chen, Zhenming (Author) Zhou, Fang (Author) Wang, Hui (Author) Yuan, Yuan (Author) Chen, Wei (Author) Gao, Min (Author) Zhan, Yanhu (Author)
Format:	electronic Article
Language:	English
Published:	2017
ISSN:	1433-0768
External Sources:	lizenzpflichtig