Evolution of the Intermetallic Compounds in Ni/Sn-2.5Ag/Ni Microbumps for Three-Dimensional Integrated Circuits

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Bibliographic Details

Published in:	Journal of electronic materials. - Springer US, 1972. - 44(2015), 10 vom: 14. Juli, Seite 3888-3895
Main Author:	Hsu, H. H. (Author)
Other Authors:	Huang, Y. T. (Author) Huang, S. Y. (Author) Chang, T. C. (Author) Wu, Albert T. (Author)
Format:	electronic Article
Language:	English
Published:	2015
ISSN:	1543-186X
External Sources:	lizenzpflichtig