Experimental and numerical study on dynamic mechanical behaviors of low-silver lead-free solder under combined compression-shear loadings

by: Niu, Xiaoyan
Published in: Journal of materials science / Materials in electronics (2019)

Effects of Multiple Impacts on the Microstructure and Dynamic Mechanical Properties of SAC0307 Alloy

by: Niu, Xiaoyan
Published in: Journal of materials engineering and performance (2022)

Determining the Constitutive Properties of Sintered Nano Silver via Reverse Analysis and Nanoindentation

by: Niu, Xiaoyan
Published in: Journal of materials engineering and performance (2022)

Experimental study on the dynamic mechanical properties of titanium alloy after thermal oxidation

by: Niu, Xiaoyan
Published in: Applied physics / A (2016)

An Arrhenius-type constitutive model to predict the deformation behavior of Sn0.3Ag0.7Cu under different temperature

by: Niu, Xiaoyan
Published in: Journal of materials science / Materials in electronics (2019)

Effect of strain rate on mechanical behavior of Sn0.3Ag0.7Cu solder at macro- and micro-scales

by: Niu, Xiaoyan
Published in: Journal of materials science / Materials in electronics (2020)

Exploring the nexus of enterprise ownership structure and food safety incidents : evidence from China

by: Niu, Xiaoyan
Published in: Emerging markets, finance and trade (2024)