Self-assembled $ SnO_{2} $ colloidal particles and their gas sensing performance to $ H_{2} $, $ C_{2} $$ H_{5} $OH and LPG

by: Ji, Hongjun
Published in: Journal of Wuhan University of Technology-Mater. Sci. Ed. (2011)

Microstructural Evolution of Lead-Free Solder Joints in Ultrasonic-Assisted Soldering

by: Ji, Hongjun
Published in: Journal of electronic materials (2015)

Ultrafine-Grain and Isotropic Cu/SAC305/Cu Solder Interconnects Fabricated by High-Intensity Ultrasound-Assisted Solidification

by: Ji, Hongjun
Published in: Journal of electronic materials (2014)

Effect of the Silver Content of SnAgCu Solder on the Interfacial Reaction and on the Reliability of Angle Joints Fabricated by Laser-Jet Soldering

by: Ji, Hongjun
Published in: Journal of electronic materials (2014)

The low temperature exothermic sintering of formic acid treated Cu nanoparticles for conductive ink

by: Liu, Jingdong
Published in: Journal of materials science / Materials in electronics (2016)

Global Dynamics of a Piecewise Smooth System for Brain Lactate Metabolism

by: Françoise, J.-P.
Published in: Qualitative theory of dynamical systems (2018)

Influence of shot peening on the microstructure and high-temperature tensile properties of a powder metallurgy Ni-based superalloy

by: Zhu, Lihua
Published in: Journal of materials science (2023)

Tailoring thermal behavior and solid–liquid contact area of Sn/Cu composite solder during ultrasonic-assisted transient liquid phase process

by: Pan, Hao
Published in: Journal of materials science / Materials in electronics (2023)

The mechanism of Pd distribution in the process of FAB formation during Pd-coated Cu wire bonding

by: Du, Yahong
Published in: Journal of materials science / Materials in electronics (2018)

Effects of Pd addition on the interfacial reactions between Cu and Al during ultrasonic welding

by: Du, Yahong
Published in: Journal of materials science / Materials in electronics (2019)

Nucleation behavior of $ Mg_{2} $Sn on Ta surface during ultrasonic-assisted soldering of Ta/Sn/Mg joint

by: Yang, Haifeng
Published in: Journal of materials science / Materials in electronics (2019)

Surface metallization of $ Si_{3} $$ N_{4} $ ceramics with high-performance silver thick paste containing Bi-B-Zn glass frit

by: Lin, Yixuan
Published in: Journal of materials science (2023)

Rapid formation of Cu–Cu joints with high shear strength using multiple-flocculated Ag nanoparticle paste

by: Hu, Bo
Published in: Journal of materials science / Materials in electronics (2019)

Highly flexible electromagnetic interference shielding films based on ultrathin Ni/Ag composites on paper substrates

by: Liu, Xiangli
Published in: Journal of materials science (2021)