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Author:
Wang, Hui
Suggested Topics:
Solder Alloy
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Solder Joint
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Author:
Wang, Hui
Suggested Topics:
Solder Alloy
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Solder Joint
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Solder Alloy
Solder Joint
Pull Force
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Aging Time
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Creep Deformation Behavior
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Increase Aging Time
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Liquid Solder
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1
Effects of rare earth element Nd on the solderability and microstructure of Sn–Zn lead-free solder
by:
Hu, Yu-hua
Published in:
Journal of materials science / Materials in electronics
(2010)
lizenzpflichtig
electronic Article
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2
Investigation on properties of Ga to Sn–9Zn lead-free solder
by:
Chen, Wenxue
Published in:
Journal of materials science / Materials in electronics
(2009)
lizenzpflichtig
electronic Article
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3
Reliability studies of Sn–9Zn/Cu and Sn–9Zn–0.3Ag/Cu soldered joints with aging treatment
by:
Chen, Wen-Xue
Published in:
Journal of materials science / Materials in electronics
(2009)
lizenzpflichtig
electronic Article
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4
Properties and microstructure of Sn-9Zn lead-free solder alloy bearing Pr
by:
Xiao, Zhengxiang
Published in:
Journal of materials science / Materials in electronics
(2010)
lizenzpflichtig
electronic Article
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FIV
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electronic Article
4
Author
Wang, Hui
Xue, Songbai
2
Ye, Huan
2
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Chen, Wen-Xue
1
Chen, Wenxue
1
Gao, Li-li
1
Gao, Lili
1
Han, Zongjie
1
Hu, Yu-Hua
1
Hu, Yu-hua
1
Hu, Yuhua
1
Wang, Jianxin
1
Xiao, Zheng-xiang
1
Xiao, Zhengxiang
1
Xue, Song-Bai
1
Xue, Song-bai
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English
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