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Sun, Fenglian
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Failure study of solder joints subjected to random vibration loading at different temperatures
by:
Zhang, Hongwu
Published in:
Journal of materials science / Materials in electronics
(2015)
lizenzpflichtig
electronic Article
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Solderability, IMC evolution, and shear behavior of low-Ag Sn0.7Ag0.5Cu-BiNi/Cu solder joint
by:
Liu, Yang
Published in:
Journal of materials science / Materials in electronics
(2012)
lizenzpflichtig
electronic Article
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Liu, Yang
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